57 results

  • Dornier 228. A platform you can rely on.

    Product of RUAG Schweiz AG
    ILA Berlin 2020 ILA Berlin 2018
    RUAG Aviation is the OEM of the Dornier 228, the most versatile and most advanced high-wing aircraft in its class. This is why authorities all over the world count on it when it comes to demanding special missions of various kinds. Key features are the long range, high utilization rates and high payload - and all this at impressively low operational costs. Pilots know that there is hardly another aircraft combining state-of-the-art technology and efficiency in the way the Dornier 228 does. …
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  • Wing & Empennage

    Product of RUAG Schweiz AG
    ILA Berlin 2020 ILA Berlin 2018
    RUAG Aerostructures is well known for our capabilities in the design and manufacturing of wing structures. We provide wing solutions for commercial and military aircraft customers such as Airbus, Boeing, Pilatus and Northrop. RUAG offers solutions at highest standards for wing and periphery structures such as flaps, spoilers, ailerons or shrouds. Our strength and experitise in both engineering and manufacturing aircrafts enable us to offer flexible, efficient and high quality products.
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  • Fuselage

    Product of RUAG Schweiz AG
    ILA Berlin 2020 ILA Berlin 2018
    RUAG Aerostructures is as a recognized technology and quality provider in the field of automated production of fuselage segments. By developing new product and manufacturing technologies and systematically implementing the best cost strategy, RUAG Aerostructures contributes to the success of our customers as a reliable partner. Technology Leadership Highly automated lean production systems Strongly developed technology competence and skills Professional Excellence First ti…
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  • Electronics for space applications

    Product of RUAG Schweiz AG
    ILA Berlin 2020 ILA Berlin 2018
    High performance, maximum reliability: Whether it is a COTS-based Single-Board Computer, a full Data- Handling System, or powerful Interface Units, we can enable the “brain power” of your spacecraft or launch rocket. In the field of precise orbit determination (POD), RUAG Space is the market leader with products ranging from cost-effective COTS solutions to full-blown GNSS (Global Navigation Satellite System) POD Receivers. We focus heavily on building cutting- edge Microwave products in all fre…
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  • Launcher products

    Product of RUAG Schweiz AG
    ILA Berlin 2020 ILA Berlin 2018
    Raising spacefaring to the next level: We contribute to the success of your launches – with market leading expertise in engineering and manufacturing of composite structures. For years, our Payload Fairings, Interstage Adapters, Payload Adapters, and Separation Systems have been the first choice among launch service providers. We have been the proud supplier of payload fairings on every Ariane rocket since its first launch in 1979, and have provided composite structures on all Atlas rockets in t…
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  • Mechanical & thermal products for satellites

    Product of RUAG Schweiz AG
    ILA Berlin 2020 ILA Berlin 2018
    Individualized or serially produced: Our Spacecraft Structures, made of metal, composite or hybrid technology, are manufactured with a high degree of automation to lower cost, provide fast time to market and enable mass production for constellation programs. RUAG Space also provides Spacecraft Mechanisms for pointing solar arrays, thrusters, antennas and instruments into the right direction, in extreme conditions, with utmost precision. We also specialize in the design and production of Slipring…
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  • Christian Beck

    Contact person of DYCONEX AG
    Director Sales
    ILA Berlin 2018
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  • Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Wrap-around technology (flexible multilayer system wrapped around a metal core) Integration of metal sheets and cores for fast heat dissipation CIC technology to control thermal expansion High reliability through copper filled microvias Miniaturized high-density solutions through ultra-thin materials, ultra-fine line technology, and advanced registration concepts EN 9100:2009 certification For optimal thermal management of electronic modules DYCONEX featu…
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  • Advanced Rigid Substrates for HF Applications, Ultra-thin Build-ups and Chip Packages

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Epoxy based laminates with low dielectric properties High Tg, low CTE and high dielectric strength Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability Impedance controlled ultra-fine line technology (down to 25 µm) High density pitch design (~175 µm) Smallest via (50 µm) in pad (100 µm) EN 9100:2009 certification DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various…
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  • Advanced LCP Substrates for HF & Microwave Applications

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS Liquid Crystal Polymer (LCP) substrates with excellent high frequency properties Fine line patterning (down to 25 µm) Precise cavity generation Air bridges Application of heat sinks and lids Liquid Crystal Polymer (LCP) is a superior organic multilayer material for RF applications with stable electrical and mechanical characteristics across a range of frequencies up to 100 GHz. Due to its very low water absorption, LCP properties remain near…
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  • Daniel Schulze

    Contact person of DYCONEX AG
    Engineering Manager
    ILA Berlin 2018
    Business for PCB's. Technical consultant for complex interconnet solutions, PCB constructions and assembly solutions on PCB's.
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  • Bernhard Schmuki

    Contact person of DYCONEX AG
    Field Application Engineer
    ILA Berlin 2018
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