20 results

  • Advanced LCP Substrates for HF & Microwave Applications

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS Liquid Crystal Polymer (LCP) substrates with excellent high frequency properties Fine line patterning (down to 25 µm) Precise cavity generation Air bridges Application of heat sinks and lids Liquid Crystal Polymer (LCP) is a superior organic multilayer material for RF applications with stable electrical and mechanical characteristics across a range of frequencies up to 100 GHz. Due to its very low water absorption, LCP properties remain near…
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  • Advanced Rigid Substrates for HF Applications, Ultra-thin Build-ups and Chip Packages

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Epoxy based laminates with low dielectric properties High Tg, low CTE and high dielectric strength Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability Impedance controlled ultra-fine line technology (down to 25 µm) High density pitch design (~175 µm) Smallest via (50 µm) in pad (100 µm) EN 9100:2009 certification DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various…
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  • AEROSTAR S.A.

    Exhibitor
    Romania
    ILA Berlin 2018
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  • Christian Beck

    Contact person of DYCONEX AG
    Director Sales
    ILA Berlin 2018
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  • Pirmin Berger

    Contact person of RUAG Group
    Head of Marketing & Communication RUAG Aviation
    ILA Berlin 2018
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  • DYCONEX AG

    Exhibitor
    Switzerland
    ILA Berlin 2018
    • Space Space
    • Supplier Supplier
    • ISC (25 - 27 April)
    DYCONEX provides high-reliability solutions in interconnect technology: Highly complex ultra-HDI/microvia PCBs, packaging and multilayer LCP substrates from design support and prototyping to the point of volume production. For more than 50 years, DYCONEX has had a long standing history in highly complex aerospace and defense applications as part of Oerlikon Contraves until the early 1990's, when it became independent. Besides covering a broad range of other similarly demanding applications …
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  • Franke Industrie AG

    Exhibitor
    Switzerland
    ILA Berlin 2018
    • Space Space
    • Supplier Supplier
    • Special Features Special Features
    • ISC (25 - 27 April)
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  • Silvan Gruber

    Contact person of RUAG Group
    Manager Strategic Communication RUAG Defence
    ILA Berlin 2018
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  • Tanja Günthart

    Contact person of RUAG Schweiz AG
    ILA Berlin 2018
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  • Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Wrap-around technology (flexible multilayer system wrapped around a metal core) Integration of metal sheets and cores for fast heat dissipation CIC technology to control thermal expansion High reliability through copper filled microvias Miniaturized high-density solutions through ultra-thin materials, ultra-fine line technology, and advanced registration concepts EN 9100:2009 certification For optimal thermal management of electronic modules DYCONEX featu…
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  • Mechanical & thermal products for satellites

    Product of RUAG Group
    ILA Berlin 2018
    Individualized or serially produced: Our Spacecraft Structures, made of metal, composite or hybrid technology, are manufactured with a high degree of automation to lower cost, provide fast time to market and enable mass production for constellation programs. RUAG Space also provides Spacecraft Mechanisms for pointing solar arrays, thrusters, antennas and instruments into the right direction, in extreme conditions, with utmost precision. We also specialize in the design and production of Slipring…
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  • Nike Möhle

    Contact person of RUAG Group
    Vice President Communications RUAG Space
    ILA Berlin 2018
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