10 results

  • Advanced LCP Substrates for HF & Microwave Applications

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS Liquid Crystal Polymer (LCP) substrates with excellent high frequency properties Fine line patterning (down to 25 µm) Precise cavity generation Air bridges Application of heat sinks and lids Liquid Crystal Polymer (LCP) is a superior organic multilayer material for RF applications with stable electrical and mechanical characteristics across a range of frequencies up to 100 GHz. Due to its very low water absorption, LCP properties remain near…
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  • Advanced Rigid Substrates for HF Applications, Ultra-thin Build-ups and Chip Packages

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Epoxy based laminates with low dielectric properties High Tg, low CTE and high dielectric strength Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability Impedance controlled ultra-fine line technology (down to 25 µm) High density pitch design (~175 µm) Smallest via (50 µm) in pad (100 µm) EN 9100:2009 certification DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various…
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  • AEROFINA

    Exhibitor
    Romania
    ILA Berlin 2018
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  • Christian Beck

    Contact person of DYCONEX AG
    Director Sales
    ILA Berlin 2018
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  • Thomas Bernhard

    Networker of Flükiger & Co AG
    Geschäftsführer
    Geschäftskontakte im Bereich Gesenkschmiedeteile für Luft- und Raumfahrt. Unser Kerngeschäft sind Gesenkschmiedestücke von 0,1 kg bis 200 kg Gewicht sowie Stauchteile (Wellen, Flansche, Hülsen) und Freiformschmiedeteile. Aus Stahl, Inox, Kupfer, Aluminium, Titan und Inconel werden Gesenkschmiedeteile von 0,1 bis 200 kg und Freiformschmiedestücke bis 500 kg hergestellt. Für Prototypen, klein- und mittelgrosse Serien (ca. 10‘000 Stk.) können wir Ihnen durch kurze Lieferzeiten, hohe Flexibilität u…
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  • DYCONEX AG

    Exhibitor
    Switzerland
    ILA Berlin 2018
    • Space Space
    • Supplier Supplier
    • ISC (25 - 27 April)
    DYCONEX provides high-reliability solutions in interconnect technology: Highly complex ultra-HDI/microvia PCBs, packaging and multilayer LCP substrates from design support and prototyping to the point of volume production. For more than 50 years, DYCONEX has had a long standing history in highly complex aerospace and defense applications as part of Oerlikon Contraves until the early 1990's, when it became independent. Besides covering a broad range of other similarly demanding applications …
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  • Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Wrap-around technology (flexible multilayer system wrapped around a metal core) Integration of metal sheets and cores for fast heat dissipation CIC technology to control thermal expansion High reliability through copper filled microvias Miniaturized high-density solutions through ultra-thin materials, ultra-fine line technology, and advanced registration concepts EN 9100:2009 certification For optimal thermal management of electronic modules DYCONEX featu…
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  • Bernhard Schmuki

    Contact person of DYCONEX AG
    Field Application Engineer
    ILA Berlin 2018
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  • Daniel Schulze

    Contact person of DYCONEX AG
    Engineering Manager
    ILA Berlin 2018
    Business for PCB's. Technical consultant for complex interconnet solutions, PCB constructions and assembly solutions on PCB's.
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  • Variosystems AG

    Exhibitor
    Switzerland
    ILA Berlin 2018
    • Supplier Supplier
    • ISC (25 - 27 April)
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