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• Advanced LCP Substrates for HF & Microwave Applications

  

  Product of DYCONEX AG

  ILA Berlin 2018
  HIGHLIGHTS Liquid Crystal Polymer (LCP) substrates with excellent high frequency properties Fine line patterning (down to 25 µm) Precise cavity generation Air bridges Application of heat sinks and lids Liquid Crystal Polymer (LCP) is a superior organic multilayer material for RF applications with stable electrical and mechanical characteristics across a range of frequencies up to 100 GHz. Due to its very low water absorption, LCP properties remain near…
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• Advanced Rigid Substrates for HF Applications, Ultra-thin Build-ups and Chip Packages

  

  Product of DYCONEX AG

  ILA Berlin 2018
  HIGHLIGHTS   Epoxy based laminates with low dielectric properties High Tg, low CTE and high dielectric strength Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability Impedance controlled ultra-fine line technology (down to 25 µm) High density pitch design (~175 µm) Smallest via (50 µm) in pad (100 µm) EN 9100:2009 certification DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various…
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• ASTROSCALE JAPAN Inc.

  

  Exhibitor

  Japan

  ILA Berlin 2018
  • Space
  • Special Features
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• B.S Brightstar Group Ltd.

  

  Exhibitor

  Israel

  ILA Berlin 2018
  • Aviation
  • Space
  • Supplier
  • ISC (25 - 27 April)
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• Christian Beck

  

  Contact person of DYCONEX AG

  Director Sales

  ILA Berlin 2018
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• VP of Bussines Development Yaron Benita

  

  Networker of IMC Microwave Industries LTD

  VP of Bussines Development at IMC
  Datalink, Data link, Antenna, Transmitter, receiver, UAV, ACMI, Transceiver, RF, Microwave, power amplifier Meet with customers and partners who are looking for microwave modules and data link systems.
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• Pirmin Berger

  

  Contact person of RUAG Group

  Head of Marketing & Communication RUAG Aviation

  ILA Berlin 2018
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• Bican Celik

  

  Contact person of Turkish Aerospace Industries Inc. TAI

  Snr.Marketing Specialist

  ILA Berlin 2018
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• Rafał Darecki

  

  Networker
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• Kamelia Duczmal

  

  Networker
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• DYCONEX AG

  

  Exhibitor

  Switzerland

  ILA Berlin 2018
  • Space
  • Supplier
  • ISC (25 - 27 April)
  DYCONEX provides high-reliability solutions in interconnect technology: Highly complex ultra-HDI/microvia PCBs, packaging and multilayer LCP substrates from design support and prototyping to the point of volume production. For more than 50 years, DYCONEX has had a long standing history in highly complex aerospace and defense applications as part of Oerlikon Contraves until the early 1990's, when it became independent. Besides covering a broad range of other similarly demanding applications …
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• FEMIA - Federación Mexicana de la Industria Aeroespacial

  

  Exhibitor

  Mexico

  ILA Berlin 2018
  • Supplier
  • ISC (25 - 27 April)
  FEMIA, the Mexican Federation of the Aerospace Industry, seeking for competitive suppliers. Contact us to learn more about our +$460 Million USD in business opportunities and qualification process in different categories.
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