45 results

  • Advanced LCP Substrates for HF & Microwave Applications

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS Liquid Crystal Polymer (LCP) substrates with excellent high frequency properties Fine line patterning (down to 25 µm) Precise cavity generation Air bridges Application of heat sinks and lids Liquid Crystal Polymer (LCP) is a superior organic multilayer material for RF applications with stable electrical and mechanical characteristics across a range of frequencies up to 100 GHz. Due to its very low water absorption, LCP properties remain near…
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  • Advanced Rigid Substrates for HF Applications, Ultra-thin Build-ups and Chip Packages

    Product of DYCONEX AG
    ILA Berlin 2018
    HIGHLIGHTS   Epoxy based laminates with low dielectric properties High Tg, low CTE and high dielectric strength Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability Impedance controlled ultra-fine line technology (down to 25 µm) High density pitch design (~175 µm) Smallest via (50 µm) in pad (100 µm) EN 9100:2009 certification DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various…
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  • ASTROSCALE JAPAN Inc.

    Exhibitor
    Japan
    ILA Berlin 2018
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  • B.S Brightstar Group Ltd.

    Exhibitor
    Israel
    ILA Berlin 2018
    • ISC (25 - 27 April)
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  • Christian Beck

    Contact person of DYCONEX AG
    Director Sales
    ILA Berlin 2018
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  • VP of Bussines Development Yaron Benita

    Networker of IMC Microwave Industries LTD
    VP of Bussines Development at IMC
    Datalink, Data link, Antenna, Transmitter, receiver, UAV, ACMI, Transceiver, RF, Microwave, power amplifier Meet with customers and partners who are looking for microwave modules and data link systems.
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  • Pirmin Berger

    Contact person of RUAG Schweiz AG
    Head of Marketing & Communication RUAG Aviation
    ILA Berlin 2020 ILA Berlin 2018
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  • Bican Celik

    Snr.Marketing Specialist
    ILA Berlin 2018
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  • DYCONEX AG

    Exhibitor
    Switzerland
    ILA Berlin 2018
    • ISC (25 - 27 April)
    DYCONEX provides high-reliability solutions in interconnect technology: Highly complex ultra-HDI/microvia PCBs, packaging and multilayer LCP substrates from design support and prototyping to the point of volume production. For more than 50 years, DYCONEX has had a long standing history in highly complex aerospace and defense applications as part of Oerlikon Contraves until the early 1990's, when it became independent. Besides covering a broad range of other similarly demanding applications …
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  • FEMIA - Federación Mexicana de la Industria Aeroespacial

    Exhibitor
    Mexico
    ILA Berlin 2018
    • ISC (25 - 27 April)
    FEMIA, the Mexican Federation of the Aerospace Industry, seeking for competitive suppliers. Contact us to learn more about our +$460 Million USD in business opportunities and qualification process in different categories.
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  • Franke Industrie AG

    Exhibitor
    Switzerland
    ILA Berlin 2018
    • ISC (25 - 27 April)
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  • Dipl.-Ing. Johannes Gerner

    Networker of Innalabs
    Regional Sales Manager
    Companies interested in inertial sensors Coriolis vibratory gyroscopes, and navigation grade, quartz servo accelerometers
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