Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management

Product of DYCONEX AG

ILA Berlin 2018

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Grindelstrasse 40
CH-8303 Bassersdorf
Switzerland

ILA Berlin 2018
  • ISC (25 - 27 April)

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Product description

HIGHLIGHTS
 
  • Wrap-around technology (flexible multilayer system wrapped around a metal core)
  • Integration of metal sheets and cores for fast heat dissipation
  • CIC technology to control thermal expansion
  • High reliability through copper filled microvias
  • Miniaturized high-density solutions through ultra-thin materials, ultra-fine line technology, and advanced registration concepts
  • EN 9100:2009 certification

For optimal thermal management of electronic modules DYCONEX features its wrap-around technology, back metal sheets, metal cores and CIC build-ups to provide PCBs for applications that demand as well high levels of integration density and maximum reliability. The use of the wrap-around technology enables the designers to separate the electrical and mechanical functions. Having a long-term expertise in delivering high-end PCBs DYCONEX has a firm understanding of the challenging high-reliability characteristics and requirements of aerospace & defense electronics. Systematic methodologies have been developed that make it possible to gather solid evidence about product reliability. DYCONEX manufacturing is based on automated standard processes using the very latest fabrication and inspection systems.