Advanced Rigid Substrates for HF Applications, Ultra-thin Build-ups and Chip Packages

Product of DYCONEX AG

ILA Berlin 2018

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Grindelstrasse 40
CH-8303 Bassersdorf
Switzerland

ILA Berlin 2018
  • Space Space
  • Supplier Supplier
  • ISC (25 - 27 April)

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Product description

HIGHLIGHTS
 
  • Epoxy based laminates with low dielectric properties
  • High Tg, low CTE and high dielectric strength
  • Ultra-thin any layer HDIs from 4 layers (~220 µm) to 8 layers (~350 µm) with highest reliability
  • Impedance controlled ultra-fine line technology (down to 25 µm)
  • High density pitch design (~175 µm)
  • Smallest via (50 µm) in pad (100 µm)
  • EN 9100:2009 certification

DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various high frequency applications particularly suitable for HF chip packaging. The material offers low dielectric properties (low Dk and low Df) combined with a low thermal expansion coefficient (CTE) and high dielectric strength.

Using any layer technology the layers of the substrates are only connected by laser drilled, copper filled microvias allowing for high-density / high-reliability designs. Other HDI build-up solutions are available in addition.